Xiaohong Yang, Bowen Zhao, Baocha Zhang, Fei Cao, Peng Xiao.Evolution of themicrostructures and properties of Cu-xCr-0.4Nb alloys.Advanced Engineering Materials.Adv. Eng. Mater. 2021, 2101403:1-10.(SCI)
X.H. Yang, C.D. Wang, L. Yang, J.T. Zou, P. Xiao, and S.H. Liang.Effects of Nb Addition and Different Cooling Methodson Microstructures and Properties of Cu-CrAlloys.Journal of Materials Engineering and Performance. 2020,29(8):5008-5017.(SCI)
Xiaohong Yang, Yipeng Zhao, Dandan Kang, Juntao Zou, Peng Xiao,Shuhua Liang.The vacuum breakdown properties and arc erosion behaviors of CuTiW alloys.Engineering Failure Analysis.2020, 2020,118:104865.(SCI)
Zhe Xiao, Xiaohong Yang, Xuejian, Juntao Zou, Shuhua Liang. Microstructural evolution and mechanical properties of CuW/CuCr interface with mixed powder interlayers by liquid diffusion bonding technique. Vacuum, 2017,137:148-154.(SCI)
Xiaohong Yang, Xuejian Li, Zhe Xiao, Juntao Zou, Shuhua Liang. Effect of Cr alloying interlayer on the interfacial bond strength of CuW/CuCr integral materials. Journal of Alloys and Compounds 2016,686:648-655.(SCI)
Yang Xiaohong, Jiang Cunhong, Zou Juntao, Wang Xianhui. Preparation and characterization of CuFe alloy ribbons. Rare Metal Materials and Engineering, 2015, 44(12): 2949-2953.(SCI)
Xiaohong Yang, Juntao Zou, Peng Xiao, Xianhui Wang. Effects of Zr addition on properties and vacuum arc characteristics of Cu-W alloy. Vacuum. 2014,106 (1): 16-20.(SCI)
Qiao Zhang, Shuhua Liang, Xiaohong Yang, Zhibing Li, Yuchun Li, Youpeng Zhang.Failure analysis of CuW/CuCrZr contact materials in capacitor bank switch. Engineering Failure Analysis. 2016, 62: 156-163.(SCI)
Jia Liu, Xian-hui Wang, Ting-ting Guo, Jun-tao Zou, Xiaohong Yang. Microstructure and properties of Cu-Ti-Ni alloys. International Journal of Minerals, Metallurgy and Materials. 2015, 22(11):1119-1204.(SCI)
Xiaohong Yang, Nina Zhang, Peng Xiao and Caiyin You. Investigation on the preparation and properties of MoCu gradient material. Materials Science Forum. 2013,749:322-327. (EI).
Peng Xiao, Yingchun Qu, Xiaohong Yang and Shuhua Liang.W-Ti Alloy Prepared by Hydrogen Reduction of Nanometer WO3-TiH2Powders. Materials Science Forum.2013, 749:316-321. (EI).
Xiaohong Yang, Yong Gao, Peng Xiao, Shuhua Liang. The effect of Cr on the properties and sintering of Wskeleton as an activated element. Materials Science & Engineering A. 2011, 528(10-11): 3883-3889. (SCI)
Xiaohong Yang, Juntao Zou, Peng Xiao, Shuahua Liang. Effect of alloying interlayer on interfacial bond strength of CuW/CuCr integral materials. Materials Science & Engineering A. 2010, 527 ( 21-22): 5631-5636. (SCI)
Xiaohong Yang,Shuhua Liang,Xianhui Wang,Peng Xiao,Zhikang Fan. Effects of WC and CeO2on microstructures and properties of W-Cu electrical contact material. International Journal of Refractory Metals and Hard Materials. 2010, 28(1-2):305-311. (SCI)
Weichan Cao,Shuhua Liang,Xiao Zhang, Xianhui Wang, Xiaohong Yang. Effect of Fe on vacuum breakdown properties of CuW alloys. Journal of Refractory Metals and Hard Materials. 2011, vol.29, no.6, pp.656-661.(SCI)
Xiaohong Yang,Zhikang Fan,Shuhua Liang,Peng Xiao. Effects of electric field on wetting behaviors of CuFe alloys on the W substrate. Journal of Alloys and Compounds. 2009,475(1-2):855-861. (SCI)
Xiaohong Yang,Peng Xiao,Shuhua Liang,Juntao Zou,Zhikang Fan. Alloying effect of Ni and Cr on the wettability of copper on W substrate. Acta Metallurgica Sinica (English Letters). 2008,21(5):369-379. (EI)
Xiaohong Yang,Wen Zhu,Zhikang Fan,Shuhua Liang,Peng Xiao. A model for predicating the interfacial bond strength of integral CuW/CuCr materials. The 6th Asian-Australasian Conference on Composites Materials (ACCM6). Sep.23-26,2008. Kumamoto,Kyushu,Japan. pp.474-477. (EI)
杨晓红,赵伊鹏,邹军涛,肖鹏,梁淑华.原位生成硼化钨对CuW合金组织与性能的影响[J].稀有金属材料与工程,2021,(2):679-686. (SCI)
杨晓红,孙特,肖鹏,梁淑华.不同粒度W粉与TiH2液相烧结制备W-10Ti合金.稀有金属材料与工程, 2013, 42(7):1492-1496. (SCI)
王彦龙,梁淑华,杨晓红,邹军涛,肖鹏.电弧作用下CuW触头的热冲击效应分析.稀有金属材料与工程, 2012,41:266-270.(SCI)
肖鹏,王妮,杨晓红. WCu假合金熔渗过程数值分析.稀有金属材料与工程, 2012, 41(12):2139-2143. (SCI)
王博,梁淑华,邹军涛,杨晓红,肖鹏. Fe含量对钼铜合金组织和性能的影响.稀有金属材料与工程, 2011,40:1621-1624 .(SCI)
杨晓红,范志康,盛尊友,梁淑华,肖鹏. Sn-8.5Zn-xBi合金系与NdFeB磁体间的润湿性.稀有金属材料与工程. 2010,39(2):238-241.(SCI).
杨晓红,王澄德,邹军涛,肖鹏,梁淑华.添加Mg及冷却方式对Cu-Cr-Zr合金组织与性能的影响.中国有色金属学报.2021,31(2):342~352. ( EI)
杨晓红,李思萌,范志康,梁淑华,肖鹏.热循环对CuW/CuCr界面强度及CuCr合金性能的影响.材料热处理学报. 2010, 31(5):107-112. ( EI)
杨晓红,范志康,梁淑华,肖鹏. Fe元素对Cu/W间润湿行为和界面特性的影响.中国有色金属学报. 2009,19(1):153-159. (EI)
杨晓红,李思萌,范志康,梁淑华,肖鹏. CuFeW触头材料的性能.高压电器. 2008,44(6):537-540.
杨晓红,范志康,梁淑华,肖鹏.添加Y2O3对CuW触头材料性能的影响.材料研究学报. 2007,21(4):414-420. (EI)
杨晓红,范志康,梁淑华,肖鹏. TiC对CuW触头材料组织与性能的影响.稀有金属材料与工程. 2007,36(5):817-821.(SCI)
杨晓红,等.一种制备CuW/低碳钢异质双金属材料的方法.发明专利号:ZL 202110440939X。授权时间:2022年4月.
杨晓红,等.一种原位自生二硼化钛强化CuW合金的方法.发明专利号:ZL201811126336.7。授权时间:2020年10月.
杨晓红,等.一种制备镀铬石墨烯/铜复合粉末的方法.发明专利号:ZL201711180667.4。授权时间:2019年10月.
杨晓红,等.一种Cu-Cr-Nb合金的制备方法.发明专利号:ZL201710737221.0。授权时间:2019年9月.
杨晓红,等.一种高强高导铜合金棒材的制备方法.发明专利号:ZL 201710736572. X。授权时间:2019年4月.
杨晓红,等.一种添加Ti元素制备CuW合金的方法.发明专利号:ZL201611043930.0。授权时间:2018年11月.
杨晓红,等.一种高界面结合强度的CuW/CuCr的制备方法.发明专利号:ZL201610813998.6。授权时间:2018年9月.
杨晓红,等.一种高熵合金用于液相连接CuW和CuCr材料的方法.发明专利号:ZL201610404109.0。授权时间:2018年5月.
杨晓红,等.一种采用Cu-La中间合金制备含稀土铜铬锆合金的方法.发明专利号:ZL201611043387.4。授权时间:2018年7月.
杨晓红,等.一种CuW/CuCr复合材料的制备方法.发明专利号:ZL 201410733892.6.授权时间:2017年3月.
杨晓红,等.电触头材料及采用熔渗法制备CuZrW电触头材料的方法.发明专利号:ZL201110273143.6.授权时间:2014年3月.
杨晓红,等.一种钼铜梯度复合材料的制备方法.发明专利号:ZL201110402806.X.授权时间:2014年2月.
杨晓红,等.一种WO3-TiH2粉末制备W-10Ti合金的方法.发明专利号:ZL201110393627.4.授权时间:2013年2月.
杨晓红,等.一种CuW70触头材料的制备方法.发明专利号:ZL201110223711.1.授权时间:2013年7月.
杨晓红,等.一种钼铜梯度材料的制备方法.发明专利号:ZL201110338026.3.授权时间:2013年10月.
杨晓红,等.一种采用冷等静压和液相烧结制备W-10Ti合金靶材的方法.发明专利号:ZL201010526957.1.授权时间:2012年4月.
杨晓红,等.一种制备TiC/CuW合金触头材料的方法.发明专利号:ZL200910021748.9.授权时间:2011年2月.
杨晓红,等.一种制备CuW/Y2O3复相触头材料的方法.发明专利号:ZL200910021746.X.授权时间:2011年7月.